Cadence Design Systems Sigrity v19.00.002 2019 Hotfix (x64)

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x64 | Languages:English | File Size: 3.55 GB

Sigrity software for simulation and signal integrity in high-frequency circuits. With the advancement of digital processing technology, the need for faster processing has grown increasingly, Prdzashgrhayy that necessarily needs to work faster circuits with higher processing speeds and higher frequencies are located. By increasing the speed signals for accurate speed up the signals on routes that are mounted on boards PCB or boards laminated issues and new problems arises in the case of Field, gripped engineers will be events such as interference, distortion and noise and signal integrity at high frequencies cause to be subject to threats.

To minimize these threats, compensate them and increase the quality of high-speed circuits, needs analysis and corrective actions that the software Allegro Sigrity it is convenient for us. The software combines technology with design, editing and routing IC and PCB coordinate Cadence® Allegro® enables advanced analysis of both pre-layout and post-layout provides for users.

The software is designed to examine various scenarios in the initial phases allows accurate design and redesign minimized. This software supports reading and writing directly on the PCB and IC design of Allego's database. Accurate simulator based on SPICE as well as built-solver for 2d and 3d extracts the user. The software also modeling the transistor-level input and output functions include power-aware IBIS 5.0 support.

Features and Applications Allegro Sigrity:
-Perform a wide range of SI analysis or Signal integrity (signal integrity)
-Early detection of design errors to increase success in the early phases
-Restrictions can be set quickly and accurately apply the basic processes
-Improve product performance through exploration and space solutions
-Evaluation of alternative topologies in infancy
-Production of S parameters of the topology and signal analysis in the form of parameter S
-Tables estimate interference designed to increase productivity
-Was approved after PCB design and IC design directly on boards
-Multiple evaluation and confirmation signals for different paths on silicon boards

Sigrity 2019 Release Accelerates PCB Design Cycles by Integrating 3D Design and 3D Analysis:

Interconnect Modeling Technology:
-Upgraded interconnect modeling technology addresses latest trends on PCB and IC package design.With signal speeds climbing to 32Gbps and faster, the need to strategically model PCBs and connectors as one structure is now required. The new Cadence® Sigrity™ 3D Workbench, included with the Sigrity PowerSI 3D EM Extraction Option (3DEM), allows users to import mechanical structures, such as cables and connectors, and merge them with the PCB. This way critical 3D structures that cross from the board to the connector can be modeled and optimized as one structure. Updates to the PCB can be automatically back-annotated to the PCB layout tool.

The 3D Workbench offers:
-SI and PI applications
-A familiar 3D look and feel
-Ability to import mechanical structures
-Ability to import electrical databases and merge with mechanical structures
-3D solid modeling (parametric and full featured)
-Simulation of:
-Twisted pair wiring (cables)
-Backplane plus connectors
-Connector modeling (HDMI, SATA, etc.)
-SMA connector on a PCB

Rigid-Flex Support:
Industry-first full Rigid-Flex PCB extraction from a single layout database provides accurate interconnect modeling of both rigid and meshed-ground flex cable zones. The zone information is automatically imported from version 17.2 of Cadence Allegro® technology.

Faster IC Package Modeling:
-IC package modeling of designs with thousands of bumps/balls is now 3X faster and memory consumption has been reduced by 75 percent.

Power Integrity Updates:
-Upgraded power integrity (PI) technology addresses new checking requirements and new usability requirements for PCB front-to-back design flows. Many enhancements have been added, including hierarchical views, quick search, and filtering, comparison tree report, and tool tips.

Allegro PowerTree™ technology:
-The DC analysis technology has been upgraded to support integration with Allegro technology, HTML block-diagram enhancements, and automated add-nodes-on-pads enhancements.

Sigrity PowerDC™ technology:
-The AC analysis technology has added some additional checks that now look at the weighted AC current and checks for equal voltage. New batch-mode "projects" allow these two new workflows as well as others to be setup as a set of batch checks.

Sigrity OptimizePI™ technology:
-Upgraded signal integrity (SI) technology accelerates the time it takes to verify memory interfaces, serial links, and the plethora of other signals on a PCB that can cause a design to fail in the lab. The technology now features workflows and visions that can be used to quickly perform electrical rule checks that find impedance variations and excessive coupling. These checks require no models and can be run by both expert and non-experts in signal integrity.

System Requirements:
-OS:Windows 7 all versions (64-bit),Windows 10 (64-bit), Windows 2012 Server (All service packs), Windows 2016 Server (All service packs)
-CPU:Recommended Hardware Intel® 4th Generation Core™ (Haswell) or AMD Kaveri
-Memory:8 GB RAM / 64 GB RAM or higher; 192 GB of RAM or higher is recommended for 3D-EM
-Virtual memory at least twice physical memory
-Space:50 GB free disk space
-Display:1,024 x 768 display resolution with true color (16bit color)
-Recommended Software Microsoft® Internet Explorer® 9.0 or later
-Three-button Microsoft-compatible mouse
-Space recommended:500 GB free disk space SSD is recommended for primary operating system (OS) and simulation working directory
-GPUedicated graphics card with 1 GB video memory or higher

WHATS NEW:
-ASI_SI Small gap occurs between two connected pin pads after translation
-CELSIUS The attached CFD case generates incorrect terminal node information
-CELSIUS Objects are missing when importing the ECXML file
-CELSIUS Copy behavior is not correct in Celsius 3D
-CLARITY Port wizard with 'Pins Connector' stops responding if 9 or more cylinders (12 sides) are selected for auto-port creation
-CLARITY Add a Tcl command to set the Path and Separator in Setup Computer Resources
-CLARITY Add a Tcl command to set up compute resources 'LSF memory unit' and 'version'
-CLARITY Add a 'Resume' function in the Setup dialog box in Windows to continue solving the failed cases
-CLARITY Simulation failed during AFS
-OPTIMIZEPI DC fitting is automatically enabled upon merging the SPIM model in 'Post-Layout Analysis'
-OPTIMIZEPI With OptimizePI Impedance Checking, save impedance curves as csv files with starting frequency as 0
-OPTIMIZEPI Cannot save capacitor location D1, D2, D3, and D4 changes in OptimizePI
-POWERDC PowerDC stops responding when running multi-board IR Drop simulation
-POWERDC Modify discrete current pass/fail condition in PowerDC
-POWERDC PowerDC simulation incorrectly shows result of certain discrete components as failed
-POWERDC Max discrete current with Lower Tolerance (-%) does not make sense in PowerDC
-POWERDC PowerDC fails when running multi-board IR drop simulation
-POWERDC PowerDC stops responding when generating report using Tcl command in multi-board IR drop flow
-POWERSI Extraction results are different in Sigrity 2018 and Sigrity 2019 for the same .mcm file
-POWERSI The order of stackup in the copy wizard is incorrect in PowerSI
-POWERSI asi_spd dll file creates translation issues in the Sigrity 2019 release
-POWERSI PowerSI Tcl command returns special characters
-POWERSI S-parameters cannot be loaded correctly in the network parameter display window using the Tcl script
-SIGRITY_SUITE BNPViewer: Y-axis Log scale is reset to Linear after loading 2nd bnp
-SIGRITY_SUITE 'Autogenerate cutting boundary' according to selected net takes too long on large designs
-SIGRITY_SUITE Ports from VRF are flagged as too wide during Clarity meshing
-SIGRITY_SUITE Setting the Special Void option in GUI does not work
-TRANSLATOR ODB++ translation incorrectly translates VCC GND shapes to unnamed nets
-TRANSLATOR Component outline/component footprint is not translated correctly when ODB++ file is translated using SPDLinks
-TRANSLATOR Translator: gds2spd lost dielectric layers
-TRANSLATOR ODBExtractor has issues with vias and pads
-TRANSLATOR GDS2SPD translates GDS layout by leaving small hole on shape
-TRANSLATOR Voids cannot be translated correctly from DXF to SPD or edited easily in Layout canvas
-TRANSLATOR ODB++ to spd translation with SPDLinks creates some nodes with different format, nodes are detected as non-pin nodes
-TRANSLATOR Missing "+" continuation line symbols for component "TIGER_LAKE_CPU" in this testcase spd file
-XCITEPI.subckt cannot be imported successfully in XcitePI

HOMEPAGE

https://www.cadence.com/

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